Download your OTHERS SAGEM HILO user guide or user manual

DON'T FORGET : ALWAYS READ THE USER GUIDE BEFORE BUYING !!!

We hope that this user guide will be useful to you.
Once downloaded, you must make sure that the Manual matches the Product for which you intend to use it. You agree to remain entirely responsible for the use you do with the instructions contained in the document, no matter whether damages of losses occur following its use.

Manual abstract: user guide

Detailed instructions for use are in the User's Guide.

[. . . ] HILO V2 APPLICATION NOTE ~ Freedom of speech for smart machines ~ This page is intentionally left blank FICHE RECAPITULATIVE / REVISION HISTORY Ed 1 2 3 4 5 Date Date 02/24/2010 Référence Reference URD1 OTL 5635. 2 007 72335 ed 01 Pages modifiées / Changed pages Observations Comments Document creation Note d'étude / Technical document : URD1­ OTL 5635. 2­ 007 / 72335 Edition 01 HiLo V2 Application Note 15 March 2011 - Page 3/58 SOMMAIRE / CONTENTS 1. OVERVIEW. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1. 1 OBJECT OF THE DOCUMENT. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1. 1 REFERENCE DOCUMENTS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1. 2 MODIFICATION OF THIS DOCUMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1. 3 CONVENTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2. BLOCK DIAGRAM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3. FUNCTIONAL INTEGRATION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3. 1 HOW TO CONNECT TO A SIM CARD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3. 2 HOW TO CONNECT THE AUDIOS?. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3. 2. 1 Connecting microphone and speaker . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3. 2. 2 Recommended characteristics for the microphone and speaker. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3. 2. 3 DTMF OVER GSM NETWORK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3. 3 PWM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3. 3. 1 PWM outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3. 3. 2 PWM for Buzzer connection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3. 4 NETWORK LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3. 5 POWER SUPPLY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3. 5. 1 Burst conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3. 5. 2 Ripples and drops . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3. 6 EXAMPLE OF POWER SUPPLIES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3. 6. 1 DC/DC Power supply from a USB or PCMCIA port. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3. 6. 2 Simple high current low dropout voltage regulator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3. 6. 3 Simple 4V boost converter. [. . . ] VBACKUP input of the module has to be connected to a 10µF capacitor (between VBACKUP and GND). Sagemcom does not recommend to connecting VBACKUP signal to VBAT as for former Sagemcom MOXX modules. 3. 13. 2 Current consumption on the backup battery When the power supply is removed, the internal RTC will be supplied by backup battery. To calculate the backup battery capacity, consider that current consumption for RTC on the backup battery is up to 1000µA depending on the temperature. Pad Name VBACKUP Note d'étude / Technical document : URD1­ OTL 5635. 2­ 007 / 72335 Edition 01 Min Max 1000µA HiLo V2 Application Note 15 March 2011 - Page 26/58 3. 13. 3 Charge by internal HiLo V2 charging function The charging function is available on the HiLo V2 without any additional external power supply (the charging power supply is provided by the HiLo V2). Charge of the back-up battery occurs only when main power supply VBAT is provided. The recommended schematic is given hereafter: R VBACKUP HiLo V2 VBACKUP HiLo V2 Backup battery 10µF capacitor Figure 29: Backup battery or 10µF Capacitor internally charged The resistor R depends on the charging current value provided by the battery manufacturer. The charging curve which is done by the HiLo V2 is given hereafter: Figure 30: Charging curve of backup battery 3. 13. 4 Backup Battery technology 3. 13. 4. 1 Manganese Silicon Lithium-Ion rechargeable Battery Sagemcom does not recommend using this kind of technology because of the following drawbacks: · The maximum discharge current is limited (Shall be compliant with the module characteristics). · The over-discharge problem: most of the Lithium Ion rechargeable batteries are not able to recover their charge when their voltage reaches a low-level voltage. To avoid this, it is necessary to add a safety component to disconnect the backup . battery in case of over­discharge condition. In such a case, this implementation is too complicated (too much components for that function). Sagemcom does not recommend using this kind of backup battery technology. Note d'étude / Technical document : URD1­ OTL 5635. 2­ 007 / 72335 Edition 01 HiLo V2 Application Note 15 March 2011 - Page 27/58 3. 13. 4. 2 Capacitor battery These kinds of backup battery have not the drawbacks of the Lithium Ion rechargeable battery. As there are only capacitors: · The maximum discharge current is generally bigger, · There is no problem of over-discharge: the capacitor is able to recover its full charge even if its voltage has previously fallen to 0V. Moreover, this kind of battery is available in the same kind of package than the Lithium Ion cell and fully compatible on a mechanical point of view. The only disadvantage is that the capacity of this kind of battery is significantly smaller than Manganese Silicon Lithium Ion battery. But for this kind of use (supply internal RTC when the main battery is removed), the capacity is generally enough. Sagemcom strongly recommends using this kind of backup battery technology. 3. 14 START THE MODULE PROPERLY AND AVOID POWER UP ISSUES This chapter gives advices on how to make a proper start of the HiLo V2 module and sums up the side effects of a non compliant power up sequence or a non compliant hardware connection between the HiLo V2 and the host CPU. 3. 14. 1 Power domains Each HiLo V2 pad is linked to a specific internal power domain as the following: · VANA is typically 2. 85V and is a general purpose analogue dedicated voltage. · VBAT is typically 3. 2V to 4. 5V and is the main system voltage. · VRTC is typically 3. 0V and is the real time clock dedicated voltage. · VGPIO is typically 2. 8V and is a general purpose digital dedicated voltage. · VSIM is typically 1. 8V or 2. 9V and is the digital SIM card function dedicated voltage. · VPERM is typically 3. 0V and is the permanent voltage dedicated to launch the power up sequence. Figure 31 provides for each 40pins of the HiloV2 the corresponding power domain. Note d'étude / Technical document : URD1­ OTL 5635. 2­ 007 / 72335 Edition 01 HiLo V2 Application Note 15 March 2011 - Page 28/58 HiLo V2 Pins 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 Signal Name VBATT VBATT GND GND /UART0_TXD /UART0_RXD /RF_TX /GPIO3 /GPIO2 VGPIO /UART1_DSR /UART1_DCD /UART1_TXD /UART1_CTS /SIM_RST /SIM_CLK /PWM0 /RESET_IN /AUX_ADC0 /INTMIC_P /HSET_OUT_P /HSET_OUT_N /PWM1 VSIM /SIM_DATA /UART1_RXD /UART1_RTS /UART1_RI /UART1_DTR VBACKUP /POK_IN /GPIO1 /PCM_OUT /PCM_IN /PCM_SYNC /PCM_CLK GND GND VBATT VBATT Function POWER POWER POWER POWER UART 0 UART 0 RF GPIO GPIO EXT_VDD UART 1 UART 1 UART 1 UART 1 SIM SIM PWM RESET ADC AUDIO AUDIO AUDIO PWM SIM SIM UART 1 UART 1 UART 1 UART 1 EXT_VDD POWER ON GPIO PCM PCM PCM PCM POWER POWER POWER POWER Power domain 3. 7V 3. 7V 0V 0V 2. 85V 2. 85V 2. 8V 2. 8V 2. 8V 2. 8V 2. 8V 2. 8V 2. 85V 2. 85V 1. 8V or 2. 9V 1. 8V or 2. 9V 2. 85V 2. 8V 2. 85V 2. 85V 3. 7V 3. 7V 2. 85V 1. 8V or 2. 9V 1. 8V or 2. 9V 2. 85V 2. 85V 2. 8V 2. 8V 3. 0V 3. 0V 2. 8V 2. 85V 2. 85V 2. 85V 2. 85V 0V 0V 3. 7V 3. 7V Figure 31 : HiLo V2 40 pins with their power domains Note d'étude / Technical document : URD1­ OTL 5635. 2­ 007 / 72335 Edition 01 HiLo V2 Application Note 15 March 2011 - Page 29/58 3. 14. 2 IO DC presence before power ON. When the VBAT is available but the module not yet started, the following I/O's raised their output. · VBACKUP raise to 3V · POK_IN raise to 3V · HSET_N raise to 1. 4V · HSET_P raise to 1. 4V 3. 14. 3 Side effects of a retro supply (current re-injection) Interactions or connections between the HiLo V2 module and the external systems can lead to retro power supply side effects, or current re-injection through pads while the module is not yet fully powered up (means VBAT lower than its minimum 3. 2V). [. . . ] The front aperture must be compliant with speaker supplier's specifications The back volume must be completely sealed. The sealed back volume must be compliant with speaker supplier's specifications Take care of the design of the speaker gasket (elastomer). Foresee a stable and large enough area for the gasket of the artificial ear. To get a better audio input design (microphone part): Take care of the design of the microphone (elastomer). about ­40 ±3 dBV/Pa. Note d'étude / Technical document : URD1­ OTL 5635. 2­ 007 / 72335 Edition 01 HiLo V2 Application Note 15 March 2011 - Page 45/58 Promote the use of pre-amplified microphone. [. . . ]

Sponsored Links